Size and shape of the Top and Bottom of the Pad will normally be rectangular, of the appropriate size for the device.
I haven't see this problem reported anywhere, and it was a pain to figure out a workaround so I thought I would post it here.ġ) When creating the footprint, the Thermal Pad should have a round hole defined (typical thermal via hole size is 0.3mm or smaller) so that Altium knows the top and bottom side pads are supposed to be connected. It might look OK in Altium but there is no tenting in the Gerber files. The obvious approach (place a via in the thermal pad and check the box for "Force complete tenting on top") doesn't work. Problem: Device with a large thermal pad (which is not covered with soldermask), needs small thermal vias in the pad to sink heat away, and those vias should be covered with a dot of soldermask to prevent solder wicking.
How to create a footprint with thermal pad & tented thermal vias in Altium Designer
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